检测技术服务_鉴定_测试_认证-腾飞检测认证（广东）有限公司

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PCB&PCBA failure analysis and detection

As a carrier of various components and circuit signal transmission hub PCB electronic information products has become the most important and key part, its quality and reliability level determines the quality and reliability of the machine equipment, due to high density, and the development trend of lead-free PCB and halogen-free environmental requirements, more and more PCB appeared poor wetting, blasting board, layered, CAF, and so on all kinds of failure problem.The failure mechanism and cause of PCB will be beneficial to the quality control of PCB in the future, so as to avoid the recurrence of similar problems.

CPST failure analysis Laboratory has an experienced and skilled service team, a variety of advanced testing and analysis instruments, to provide customers with efficient, accurate, fair testing and analysis services.

Failure analysis of PCB products as follows：

1. Surface bubbling and layering;

2.Welding resistance film falls off;

3. Blackened surface of the board;

4. Migration, oxidation corrosion

5. Open circuit short circuit

PCBA lead-free solder joint reliability Test:

The appearance of procuratorial	Infrared microscopic analysis	Acoustic scanning analysis	Temperature shock
Metallographic	X-rayFluoroscopy	Strength (tensile, shear)	Temperature cycle
SEM/EDS	Computerized tomography analysis	Tin ball thrust	High temperature and high humidity
Drop test	Random vibration	Room temperature often wet	High temperature and high humidity
Temperature cycle	SEM inspection	Dyeing test	The thickness of the coating
Tin ball tension test (mainly for BGA tin ball，CableEtc.)

PCBThe main test items are:

PCBMechanical properties of	PCBThermal properties	PCBReliability test	PCBElectrical performance test
1. Visual inspection	1. Coefficient of thermal conductivity	1. Cleanliness (ion contamination) test	1. Withstand voltage
2. Size measurement	2. Thermal resistance	2. Hygroscopic (water) property	2. Insulation resistance test
3. Microdimensional detection	3. Coefficient of thermal expansion	3. Copper clad laminate test	3. Moisture resistance and insulation resistance
4. Hole size measurement	4. Thermogravimetric temperature	4. Salt spray test	4. Surface/volume resistivity
5. Hole metal coating dimension measurement	5. Blasting plate timeT260/T288	5. Multilayer printed circuit board mechanical shock	5. Heat cycle test the resistance change of metallized hole
6. Lateral/concave erosion	6. Thermal cracking temperatureTd	6. Rigid printed circuit is vibration resistant
7. Bending strength test	7. The thermal stress	7. Rigid printed board thermal shock
8. Flexural strength of rigid insulating laminates	8. Flame retardant test (plastic, PCB substrate)	8. Heat oil
9. Peel strength test (copper clad laminate, PCB)	9. Weldability test	9. Mould test
10. Elongation of copper foil	10. Heat stress test for through hole of coating	10. The thermal stress
11. Coating adhesion	11. Vitrification transition temperature度	11. Steam aging
12. Coating porosity		12. Weldability test
13. Warping degree test
14. Tensile strength test Bonding strength and bonding strength of non-supporting element hole connecting plate, vertical pull test of surface assembly bonding plate