Introduction to X-ray fluoroscopy

1. X-ray fluoroscopy is a method to detect internal defects of samples by means of X-ray intensity after attenuation in different parts of samples according to the difference of X-ray absorptivity and transmittance in different parts of samples.The attenuation degree of X-ray is related to the material variety, thickness and density of the sample.The X-ray intensity of the material decreases exponentially with the X-ray absorption coefficient and thickness of the material, and the internal structure and defects of the material correspond to X-ray images with different blackness.

2. The resolution of X-ray fluoroscope is 0.25 micron, which can realize 360° horizontal rotation and ±45° Z direction adjustment of the backside object.Three-dimensional X-ray examination can realize two-dimensional section and three-dimensional representation diagram, avoid overlapping of images and confusion of real defects, and can clearly show the internal structure of the object under test, thus improving the ability to recognize the internal defects of the object.

3. X-ray fluoroscopy is generally used to detect the internal structure of electronic components and printed circuit boards, internal lead open or short circuit, bonding defects, solder joint defects, packaging cracks, cavities, Bridges, steles and device leakage defects;It can also detect the internal structure and defects of connectors, electronic integrators, cables, fittings, plastic parts, aluminum castings, etc.

About X-ray perspective testing: