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Failure analysis and testing of electronic components

Failure analysis and testing of electronic components

Failure analysis and testing of electronic components

Failure analysis plays an important role in product reliability quality assurance and improvement. It is necessary to introduce failure analysis in product research and development, production and use.As an important part of CPST one-stop service, CPST failure analysis Laboratory has an experienced and skilled service team and a variety of advanced testing and analysis instruments, which can provide customers with efficient, accurate and fair testing and analysis services.

 

Significance of electronic Components testing:

1. Components factory: obtain the basis for improving product design and process;

2. Complete machine factory: obtain the basis of claim, change component suppliers, improve circuit design, improve circuit board manufacturing process, improve testing technology, and design protection circuit;

3. Complete machine user: obtain the basis of improving operating environment and operating procedures, improve product yield and reliability, set up enterprise image and improve product competitiveness.

Extended applications of failure analysis techniques:

1. Role of incoming stock analysis: select high-quality supply channels to prevent fake and shoddy components from entering the whole production line;

2. The role of good quality analysis: a shortcut to learning advanced technology.

 

Evaluation of process suitability of electronic components:

1. Reflow sensitivity tests are performed according to standard J-STD 020, including temperature and humidity treatment and reflow welding;

2. Weldability test;

3. Solubility test of metal layer;

4. Resistance to welding heat test.

Routine testing of electronic components:

 

 1. unsealing

 17. Lead bonding strength

 2. Take grain

 18. Chip bonding strength

 3. Chip layer removal

 19. On the back of the grinding

 4. To convex pieces of gold

 20. TEM

 5. dyeing

 21. EELS

 6. High resolution photomicrography

 22. AFM

 7. BGA(PCB)&ICCircuit drawing service

 23. C-AFM

 8. Scanning electron microscopy

 24. SIMS

 9. High/low order made fixed point cross section cutting

 25. TOF-SIM

 10. EMMILC Liquid crystal hot spot detection

 26. AES

 11. OBIRCH application

 27. XPS

 12. Electrostatic discharge(ESD)test

 28. XRD

 13. Probe the application

 29. STEM

 14. LCRapplication

 30. FIB-Line repair

 15. I-VCurve measurement

 31. XRadiographic examination

 16. Laser cutting

 32. Ultrasonic scanning(C-SAM)

 

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