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Service
Failure analysis and testing of electronic components
Failure analysis and testing of electronic components
Failure analysis and testing of electronic components
Failure analysis plays an important role in product reliability quality assurance and improvement. It is necessary to introduce failure analysis in product research and development, production and use.As an important part of CPST one-stop service, CPST failure analysis Laboratory has an experienced and skilled service team and a variety of advanced testing and analysis instruments, which can provide customers with efficient, accurate and fair testing and analysis services.
Significance of electronic Components testing:
1. Components factory: obtain the basis for improving product design and process;
2. Complete machine factory: obtain the basis of claim, change component suppliers, improve circuit design, improve circuit board manufacturing process, improve testing technology, and design protection circuit;
3. Complete machine user: obtain the basis of improving operating environment and operating procedures, improve product yield and reliability, set up enterprise image and improve product competitiveness.
Extended applications of failure analysis techniques:
1. Role of incoming stock analysis: select high-quality supply channels to prevent fake and shoddy components from entering the whole production line;
2. The role of good quality analysis: a shortcut to learning advanced technology.
Evaluation of process suitability of electronic components:
1. Reflow sensitivity tests are performed according to standard J-STD 020, including temperature and humidity treatment and reflow welding;
2. Weldability test;
3. Solubility test of metal layer;
4. Resistance to welding heat test.
Routine testing of electronic components:
1. unsealing |
17. Lead bonding strength |
2. Take grain |
18. Chip bonding strength |
3. Chip layer removal |
19. On the back of the grinding |
4. To convex pieces of gold |
20. TEM |
5. dyeing |
21. EELS |
6. High resolution photomicrography |
22. AFM |
7. BGA(PCB)&ICCircuit drawing service |
23. C-AFM |
8. Scanning electron microscopy |
24. SIMS |
9. High/low order made fixed point cross section cutting |
25. TOF-SIM |
10. EMMILC Liquid crystal hot spot detection |
26. AES |
11. OBIRCH application |
27. XPS |
12. Electrostatic discharge(ESD)test |
28. XRD |
13. Probe the application |
29. STEM |
14. LCRapplication |
30. FIB-Line repair |
15. I-VCurve measurement |
31. XRadiographic examination |
16. Laser cutting |
32. Ultrasonic scanning(C-SAM) |
Service
- Adhesive and tape testing
- Material hardness test
- Failure analysis and testing of composite materials
- Electronic process material testing
- Failure analysis and testing of electronic components
- Mechanical testing of materials
- Nondestructive testing of industrial products
- Failure analysis and testing of metal materials and components
- slice analysis
- Nondestructive testing of electronic products
- PCB&PCBA failure analysis and detection